Broadcom Pursues $60B+ Debt Package for AI Chip Financing

Broadcom negotiates massive AI infrastructure financing

Broadcom is negotiating with a consortium of lenders to secure more than $60 billion in debt financing for an AI chip deal, according to Bloomberg News. The semiconductor company's financing package would support AI infrastructure benefiting Anthropic and other technology firms.

The proposed structure includes approximately $30 billion in junior debt, with Broadcom guaranteeing a portion of the senior-secured tranche that could range between $60 billion and $70 billion. Under the terms currently being discussed, the total capital raise could reach $100 billion.

Blackstone and Apollo Global Management are in discussions to participate in the financing arrangement. The involvement of these private equity giants follows a partnership the three companies established in June, though specific details of that earlier agreement were not disclosed in the report.

Why it matters

This financing represents one of the largest debt packages ever assembled for semiconductor infrastructure, signaling the scale of capital required to build AI computing capacity. For enterprise technology leaders, the deal underscores the massive investment flowing into AI chip production and custom silicon development. The structure—with Broadcom guaranteeing portions of the debt while partnering with major financial institutions—suggests a shared-risk model for funding the expensive infrastructure needed to train and deploy large language models. Companies dependent on AI compute capacity should monitor whether this financing model becomes a template for future infrastructure deals.

Financial engineering for AI scale

The proposed debt structure reflects the complexity of financing large-scale AI infrastructure projects. By splitting the package between junior and senior-secured tranches with varying guarantee levels, Broadcom and its financial partners are distributing risk across multiple parties while maintaining the scale necessary for meaningful AI chip production capacity.

The participation of Blackstone and Apollo—two of the world's largest alternative asset managers—brings substantial capital deployment capabilities to the arrangement. Their involvement suggests institutional investors view AI infrastructure as a viable long-term investment despite the capital-intensive nature of semiconductor manufacturing.

Neither Broadcom, Apollo, nor Blackstone responded to requests for comment on the financing discussions.

These details were first reported by Bloomberg News, citing sources familiar with the negotiations.